Graduate Program Management Intern – SiC Module Development

Job Description

Program Management Intern – SiC Power Modules | Navitas Semiconductor

The Tone:
This is an internship at Navitas Semiconductor, located in Irvine, CA. Navitas Semiconductor develops next-generation power semiconductors, specifically gallium nitride (GaN) and high-voltage silicon carbide (SiC) technologies, for applications like AI data centers, high-performance computing, and industrial electrification. This role is crucial for supporting the development of high-power SiC-based modules, coordinating teams, and engaging with suppliers to ensure new products launch on schedule and meet technical requirements. The intern will actively contribute to the New Product Introduction (NPI) process.

The TL;DR
• Role: Internship
• Location: In-person, Irvine, CA
• Team: Program Management team, supporting SiC Power Modules
• Mission: Coordinate cross-functional teams, track program milestones, and engage with semiconductor suppliers to drive SiC power module development projects to launch on time and within specification.
• Tech Stack: Microsoft Office Suite (Excel, PowerPoint, Project), project management tools (Asana, Jira, Smartsheet), AI tools (Copilot, Claude, PowerAutomate, PowerBI)

What You’ll Actually Do
• Lead NPI program management activities for SiC high-power module development programs targeting AI and electrification end markets.
• Own and maintain detailed program schedules, milestone trackers, and risk registers to ensure projects launch on time and within technical specifications.
• Coordinate and communicate with suppliers, manufacturing partners, and internal stakeholders to align on program requirements and deliverables.
• Execute and refine the NPI process gate reviews, including design reviews, qualification milestones, and product release criteria.
• Prepare executive program status reports, dashboards, and presentations for senior leadership review.

The Must-Haves
• Background: Currently enrolled in or accepted to a graduate-level MS or PhD program in Electrical Engineering, Power Electronics, or a closely related discipline, with a foundational knowledge of semiconductor device physics, power electronics, or semiconductor manufacturing processes.
• Experience: Demonstrated strong organizational and communication skills with the ability to manage multiple concurrent tasks and deadlines.
• Skills: Ability to communicate clearly with internal teams and external suppliers abroad, including professional and articulate speaking skills; proficiency in Microsoft Office Suite (Excel, PowerPoint, Project) and/or project management tools (e.g., Asana, Jira, Smartsheet); expert at using AI tools to assist in automating tasks and ideation.
• Bonus: Prior internship, co-op, or research experience within the semiconductor, power electronics, or hardware product development industry; familiarity with Silicon Carbide (SiC) or Wide Bandgap (WBG) semiconductor technologies, process flows, or device characterization; exposure to NPI, stage-gate, or structured product development processes; understanding of power module packaging concepts; experience working in cross-functional or cross-cultural teams; coursework or research in AI hardware, power conversion systems, or electrification platforms.