Packaging Assembly Integration Engineer

Job Description

Packaging Assembly Integration Engineer | GlobalFoundries

The Tone:
This is an early career position at GlobalFoundries, a leading full-service semiconductor foundry. The company provides design, development, and fabrication services, specializing in Advanced Packaging and Photonics for next-generation optical interconnects and heterogeneous integration. This role is crucial for delivering industry-leading electro-optical transceivers using GF’s Photonix platform and advanced packaging techniques like 2.5D and 3D co-packaged optics for AI, HPC, and data center applications. The engineer will ensure the compatibility of photonic and electrical interconnect solutions to meet customer requirements and transform industries.

The TL;DR
• Role: Early Career
• Type: Full-time
• Location: On-site
• Pay: $65400–$145800 yearly
• Mission: Solve packaging assembly integration challenges to deliver industry-leading electro-optical transceivers and advanced packaging solutions that meet customer requirements.
• Tech Stack: SiPh Flip Chip assembly, detachable fiber optic couplers, grating couplers, edge couplers, passive V-groove, 3D MEMs spot size converters, Copper RX, Copper uPillar, chip-on-wafer hybrid bonding, wafer-to-wafer hybrid bonding

What You’ll Actually Do
• Define Integration: Define process integration specifications and manufacturing-driven design rules for co-packaged optics and SiPh advanced packaging, with a focus on optimizing cost, yield, and reliability of the solutions.
• Lead Reviews: Lead packaging design reviews, materials selection, and Failure Mode and Effects Analysis (FMEAs) to establish standardized quality expectations and proactively prevent costly redesigns in future development cycles.
• Drive Innovation: Drive advanced packaging innovation, facilitate customer design enablement, and develop efficient manufacturing processes by collaborating closely with internal teams and external OSAT (Outsourced Semiconductor Assembly and Test) ecosystems.
• Resolve Issues: Identify and resolve complex process integration, technical, and yield issues through cross-functional collaboration, strategic project management, and rigorous data-driven analysis to maintain product performance.
• Develop Methods: Develop advanced characterization methods, create specialized test structures, and refine derivative processes to support new packaging designs and consistently meet evolving customer requirements for functionality and reliability.

The Must-Haves
• Background: Graduating Master’s or PhD in Electrical Engineering or a related field; Early Career.
• Experience: Internship or research experience in Photonics and Optical assembly; minimum 3.0 GPA.
• Skills: Photonics and optical assembly, SiPh Flip Chip assembly process interactions, process integration definition.
• Bonus: Strong foundation in materials science, thermal, mechanical, and simulation disciplines; hands-on experience in packaging process integration, Design of Experiments (DOE), and failure analysis; proven experience in photonics and electrical interconnects with successful product releases; deep expertise in chip-package interaction across 2D, 2.5D, 3D, and 3.5D SiPh architectures; project management, written and verbal communication, and strong planning & organizational skills.