Manufacturing Leadership Program (MLP) Engineer – Class of 2027

Job Description

Manufacturing Leadership Program Engineer – Class of 2027 | General Dynamics Mission Systems

The Tone:
This is a full-time, three-year rotational development program at General Dynamics Mission Systems, located in Pittsfield, Massachusetts. The company engineers a diverse portfolio of high-technology solutions, products, and services that enable customers to successfully execute missions across all domains of operation. This role is crucial for developing future technical and operational leaders who will advance manufacturing and engineering capabilities to support critical national defense efforts.

The TL;DR
• Role: Rotational Program Engineer
• Type: Full-time
• Location: In-person, Pittsfield, MA
• Pay: $77843–$86358 yearly
• Mission: Develop manufacturing and engineering expertise to support critical defense missions and build a foundation for technical leadership within the company.
• Tech Stack: Lean, Six Sigma, AI, data-driven tools

What You’ll Actually Do
• Process Optimization: Develop and improve manufacturing performance and product delivery through technical problem-solving and process optimization.
• Manufacturing Development: Create and enhance manufacturing processes, methods, and tooling for various products.
• Production Support: Ensure production readiness, capacity planning, and process validation across manufacturing operations.
• Continuous Improvement: Drive initiatives using Lean and Six Sigma principles to analyze production data and identify yield, quality, and efficiency improvements.
• New Product Introduction: Support the integration of new products and technologies into manufacturing environments.

The Must-Haves
• Background: Bachelor’s degree in Manufacturing Engineering, Industrial Engineering, Mechanical Engineering, or a related engineering field is required, with a commitment to pursue a company-sponsored Master’s degree for program completion. This is an entry-level role.
• Experience: Demonstrated leadership experience; U.S. citizenship is required for security clearance eligibility.
• Skills: Strong critical thinking and problem-solving abilities; strong interpersonal and communication skills; high motivation and initiative; interest in manufacturing systems, engineering, and operational excellence.
• Bonus: GPA 3.2 minimum (3.6 preferred); Department of Defense secret security clearance is preferred at time of hire.