Engineering Intern

Job Description

Engineering Intern | HII Mission Technologies

The Tone:
This is an internship at HII Mission Technologies, located in the Greater Syracuse-Auburn Area, for the year 2026. HII Mission Technologies builds national defense technology solutions across various domains, including C5ISR, AI, Big Data, cyber operations, and unmanned underwater vehicles, in service of mission partners globally. This Engineering Intern role offers a meaningful career opportunity to aid in the design and analysis of highly complex embedded systems, which are critical to advanced Intelligence, Surveillance, and Reconnaissance (ISR) systems. Join a team dedicated to defending national interests in cyberspace and anticipating emerging threats.

The TL;DR
• Role: Internship
• Type: Part Time/Hourly/Non-Exempt
• Location: In-person, Greater Syracuse-Auburn Area
• Pay: $40911–$58000 yearly
• Team: Warfare Systems (WS), a business group within HII’s Mission Technologies division
• Mission: Aid with design and analysis for highly complex embedded systems at the heart of various Intelligence, Surveillance, and Reconnaissance (ISR) systems.
• Tech Stack: Microcontrollers, FPGAs, SoCs, MPSoCs, MCUs, MPUs, DSPs, sensors, power electronics, analog front-end (ADC, DAC), RF front end, high speed memory (DDR3/4), high speed serial communication (SGMII, Aurora, PCIe Gen 3, USB 3.1), low speed serial communication interfaces (UART, I2C, SPI), IBIS models, S-parameters

What You’ll Actually Do
• Design & Development: Research, develop, and test complex electrical products and systems across digital, power, RF, and analog domains.
• Prototyping: Oversee prototype development activities to meet design specifications and project timelines.
• Schematic & PCB Design: Generate electrical schematics and design complex printed circuit board assemblies (PCBAs) and integrated electrical systems, including cabling.
• System Integration: Develop mixed-signal systems incorporating microcontrollers, FPGAs, DSPs, sensors, and high/low-speed communication interfaces.
• Analysis & Documentation: Perform detailed analyses on system performance, reliability, and capability, documenting designs for cross-functional collaboration.

The Must-Haves
• Background: Must be a U.S. citizen working towards a Bachelor’s degree in Electrical, Software, or Mechanical Engineering, with between 20% and 40% of the required credits completed.
• Experience: No specific years required, but will involve hands-on system and board level integration and testing.
• Skills: Strong academic background in relevant engineering fields, flexibility and creativity in developing successful design solutions, and familiarity with embedded system techniques.
• Bonus: Experience defining requirements, schematic capture, PCB layout, design verification testing, multi-Gbps serial communications links, high-speed simulation, power analysis, EMI/EMC testing, and experience with Radar, EW, software defined radio, or electro-optical system design. Ability to work on multi-disciplinary engineering teams and in rapidly changing priority environments.