Advanced Manufacturing Engineering Student/Intern

Job Description

Advanced Manufacturing Engineering Student/Intern | Intel

The Tone:
This is an internship at Intel, located primarily in Hillsboro, OR, with additional opportunities in Phoenix, AZ, and Albuquerque, NM, operating under a hybrid work model. Intel builds exceptionally engineered technology and brings AI everywhere, creating world-changing innovations. This role is crucial for contributing to the drive for results and the relentless pursuit of quality, ensuring customer needs are met with precision. Interns will play a pivotal part in developing cutting-edge manufacturing processes, optimizing factory layouts, and enhancing overall manufacturing efficiency and performance to create the newest technologies and a brighter, more connected future.

The TL;DR
• Role: Internship
• Type: Student / Intern
• Location: Hillsboro, OR (Hybrid)
• Pay: $72,900.00–$98,600.00 USD yearly
• Mission: Develop and optimize advanced manufacturing processes and procedures to enhance efficiency and performance for cutting-edge technology production.

What You’ll Actually Do
• Develop: Develop cutting-edge manufacturing processes.
• Optimize: Collaborate on the design and optimization of factory layouts and tailor machinery to meet production needs.
• Innovate: Innovate procedures that enhance manufacturing efficiency and performance.
• Contribute: Apply STEM education to various engineering specializations, including Operations, Module Engineering, and Process Integration.
• Maintain: Help ensure manufacturing facilities operate to high standards for creating advanced technologies.

The Must-Haves
• Background: Candidate must be enrolled/pursuing a Master’s degree OR PhD in Chemical Engineering, Electrical Engineering, Material Science, Microelectronics Engineering, Mechanical Engineering, Chemistry, Physics, or a related STEM field.
• Experience: 3+ months of educational or industry experience.
• Skills: Semiconductor Equipment, Fabrication Process, Statistics and Data Analytics, Failure Analysis, Manufacturing Process Control.
• Bonus: A GPA of 3.0 or higher.