Mechanical Engineering Intern
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Job Description
About Qualcomm Technologies, Inc.:
Headquartered in San Diego, Qualcomm has been inventing technologies for over 30 years, enabling advancements in smartphones, smart cities, autonomous cars, and virtual reality. Their innovations span 5G, artificial intelligence, IoT, automotive, and extended reality applications. Qualcomm is a leader in researching the next global wireless standard and collaborates with industry leaders to bring these technologies to market. They aim to create an intelligently connected future.
Job Description: Qualcomm Mechanical Engineering Internship (Summer 2025)
This is a general description for multiple Mechanical Engineering internship positions within Qualcomm for Summer 2025. Specific roles will vary. Interns will contribute to various projects within areas such as:
• Signal integrity
• IC packaging
• High-performance chip/package CPI analysis
• Power integrity
• Thermal engineering
Minimum Qualifications:
• Currently enrolled in a bachelor’s, master’s, or Ph.D. degree program in computer engineering, computer science, electrical engineering, or a related field.
• 1+ years of academic experience with programming languages such as Python and Matlab.
• Availability for 11-14 weeks during Summer 2025 (May-September).
• Graduation date of December 2025 or later.
Preferred Qualifications:
• Familiarity with Cadence Sip, AutoCAD, and Solidworks.
• Coursework in Solid Mechanics, Mechanics of Materials, and Finite Element Analysis (FEA).
• Knowledge in mechanical design, heat transfer, and microelectronics devices.
• Knowledge of IC packaging structures, chip-package, electronic packaging processes, and package-board interaction.
• Experience with server product design, system impedance testing, fan performance measurement, and heatsink design methodology.
• Experience with thermal system design, analysis, modeling, testing, and next-generation cooling solutions.
• Experience with package design, advanced packaging, and heterogeneous integration.
• Experience with thermal management of electronics.
• Experience with Computational Fluid Dynamics.
• Experience with wind tunnel and/or airflow bench operation.
• Candidates actively pursuing a degree with an anticipated graduation between December 2025 and June 2026 are preferred.
Qualcomm’s Internship Program:
Qualcomm offers a comprehensive internship program. Interns work on real-world projects with mentorship, manager support, and access to the entire employee community. The program includes professional development workshops, social events, cross-functional speaker sessions, and an executive speaker series. Benefits include competitive hourly pay, accrued vacation time, relocation coverage, and furnished housing.
