Process Engineer – Laser Device Backend

Job Description

Senior/Staff ChipFab Process Engineer | Broadcom

The Tone:
This is a full-time role at Broadcom, primarily focused on overseeing Chip Fab backend processes for laser devices across subcontractor facilities, with a significant presence required for operational oversight, including in Malaysia. Broadcom is a global technology leader that designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions, with this role specifically contributing to their critical laser device manufacturing. This position is crucial for driving productivity, ensuring high yield, maintaining stringent quality and reliability standards, and ultimately guaranteeing the company’s ability to consistently meet shipment commitments for its advanced laser products.

The TL;DR
• Role: Full Time
• Type: Full-time
• Location: In-person – Malaysia

• Mission: Owns the Chip Fab backend processes for laser devices, driving productivity, yield, quality, and reliability across subcontractor facilities and ensuring shipment commitments are met.
• Tech Stack: JMP, Tableau, SQL, JMP scripting, AutoCAD, SolidWorks

What You’ll Actually Do
• Technical Leadership & Decision-Making: Serve as the technical lead and key decision-maker for wafer scribing, stacking, and unstacking backend operations, defining requirements for equipment and process engineering.
• Subcontractor Operations Management: Act as a Resident Engineer to oversee day-to-day subcontractor manufacturing operations across regions, utilizing remote monitoring to ensure shipment commitments are consistently met.
• Capacity & Process Scaling: Lead the buy-off and qualification of new equipment to support production scaling, collaborating with R&D, Product, and Quality teams, and driving New Process Integration (NPI) from design to high-volume manufacturing.
• Quality & Yield Improvement: Perform deep-dive root cause analysis to resolve process excursions, implement robust Corrective and Preventive Actions (CAPA), and define comprehensive process control plans including SPC strategies, FMEA, and OCAP.
• Performance Monitoring & Reporting: Establish dashboards and KPIs to track the health of wafer scribe and laser bar stack/unstack processes, monitor daily cycle times, flag critical issues, and provide periodic management reports while analyzing statistical data to identify yield detractors.

The Must-Haves
• Background: Master’s Degree in Engineering (Physics, Electrical Engineering, or Mechanical Engineering). This role functions as a Senior/Staff Process Engineer owning Chip Fab backend processes for laser devices.
• Experience: 5 to 15 years in backend processes, including a minimum of 5 years of hands-on experience with dicing, scribe & cleave, Pick-and-Place (PnP), automated bar-handling, AVI tools, burn-in processes, wafer mounting tools, hoop ring tape transfers, and mechanical/precision engineering concepts.
• Skills: Strong understanding of statistics, including SPC, DOE, FMEA, DMAIC, process capability indices (Cpk, Ppk), and equipment reliability metrics (MTBA, MTBF). Proficiency in data analysis tools such as JMP, Tableau, SQL, and JMP scripting for automation. Solid knowledge of laser manufacturing principles using InP and GaAs materials.
• Bonus: Experience with AutoCAD and SolidWorks software.