Engineering Intern

Job Description

Engineering Intern | HII Mission Technologies

The Tone:
This is an Engineering Intern position with HII Mission Technologies. HII’s Mission Technologies division delivers all-domain expertise and advanced technologies in service of mission partners across the globe, focusing on national security solutions for government and commercial customers, including C5ISR, AI and Big Data, cyber operations, and unmanned underwater vehicles. In this role, you will contribute to the design and analysis of highly complex embedded systems crucial for Intelligence, Surveillance, and Reconnaissance (ISR) systems, directly supporting critical national security missions.

The TL;DR
• Role: Internship
• Type: Part Time/Hourly/Non-Exempt
• Team: Warfare Systems (WS) business group within HII’s Mission Technologies division
• Mission: Aid with design and analysis for highly complex embedded systems at the heart of various Intelligence, Surveillance, and Reconnaissance (ISR) systems.
• Tech Stack: microcontrollers, FPGAs, SoCs, MPSoCs, DDR3/4, SGMII, Aurora, PCIe Gen 3, USB 3.1, UART, I2C, SPI

What You’ll Actually Do
• Design: Research, design, develop, and test complex electrical products or systems, including digital, power, RF, and analog components.
• Prototype: Conduct prototype development activities to ensure compliance with specifications and project milestones.
• Schematics: Create electrical/electronic schematics and design complex PCBAs, integrated electrical systems, cabling, and wire harnesses.
• Analysis: Conduct analyses to address issues such as failure, reliability, capacity, or capability of designs.
• Integration: Perform hands-on system and board level integration and testing, including drafting test plans and procedures.

The Must-Haves
• Background: Working towards a Bachelor’s degree in Electrical, Software, or Mechanical Engineering with between 20% and 40% of required credits completed.
• Experience: Intern level, with a strong academic background in Electrical, Software, or Mechanical Engineering. U.S. citizenship is required.
• Skills: High degree of flexibility and creativity to develop design solutions utilizing embedded system techniques, ability to work on multi-disciplinary engineering teams, and ability to adapt to rapidly changing priorities.
• Bonus: Experience defining requirements, performing schematic capture, executing or managing PCB layout, and executing design verification testing. Experience with multi-Gbps serial communications links (including simulation using IBIS models, S-parameters), power analysis (DC drop, power plane impedance, decoupling), and EMI/EMC testing, debug, and interpretation. Experience with Radar, EW, software defined radio, and electro-optical system design is preferred.