Engineering Internship
Are you applying to the internship?
Job Description
About the Company:
Amphenol High Speed Products Group is a market leader in high-speed, high-bandwidth electrical connectors for the telecom/datacom market. Their products are used by major Tier 1 OEMs globally in applications such as mobile networks, storage, servers, routers, and switches. The company has global headquarters in Nashua, NH, with design, sales, and manufacturing locations worldwide. They are known for their commitment to employee support and responsiveness, offering opportunities for career growth within a global organization. Amphenol emphasizes the impact each employee can have on the business. They are an Equal Opportunity Employer.
Job Description: Engineering Internship (Summer 2025)
Location: Multiple locations including Valley Green, PA; Nashua, NH; Hamden, CT; and Hampton, NH.
Wage: Depends on experience.
Summary: Amphenol is seeking multiple interns for Summer 2025 to support various engineering groups, including Field Applications Engineering, Development Engineering, Process Engineering, Product Development Engineering, and Signal Integrity Engineering.
Responsibilities: Interns will gain experience in several areas, depending on the assigned group. Examples include:
• Mechanical Engineering related tasks:
• Engineering build/manual assembly of prototypes.
• 3D modeling and engineering drawings using CAD software (Pro-E or Solidworks experience preferred).
• Finite Element Analysis (FEA) (experience desirable).
• Mechanical and electrical lab testing support.
• Documentation of test results and presentations.
• Component/assembly quality inspection.
• Collaboration with other engineering disciplines in the design and manufacturing process.
• Electrical Engineering related tasks:
• Design, simulation, characterization, and application of high-speed electrical connectors, backplane systems, and cable-based interconnects.
• Circuit and PCB layout, understanding of electromagnetic (EM) issues, and signal integrity in PCB layout.
• Testing of high-speed interconnect products using VNA or TDR equipment and other general lab functions.
• Assisting customers in solving high-speed data transmission problems.
• Collaborating with internal Sales Engineers on product strategies.
• Experience with signal integrity and simulation/analysis tools (Ansys HFSS and Designer, CST Microwave, HSPICE, MatLab, and ADS are a plus but not required).
• Frequency-domain and time-domain component and circuit characterization, including understanding of test and calibration methods.
Qualifications:
Candidates should be at least sophomores in Mechanical, Electrical, or Plastics Engineering programs. Specific experience requirements vary depending on the engineering discipline:
• Mechanical Engineering: Pro-E or Solidworks experience is preferred. FEA tool experience is desirable. Strong communication and teamwork skills are essential.
• Electrical Engineering: Experience with signal integrity and simulation/analysis tools is a plus but not required. A strong understanding of frequency-domain and time-domain component and circuit characterization is beneficial.
All candidates should possess strong communication skills (technical and non-technical) and the ability to work effectively in a team environment.
