Hardware Prototyping Intern

June 27, 2026
$38 - $55 / hour

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Job Description

Hardware Prototyping Intern – Data Center Rack | Bosch USA

The Tone:
This is a temporary internship at Bosch USA, focusing on advanced data center rack systems. Bosch is a global company that invents high-quality technologies and services, shaping the future through innovation in connected living, mobility, and industry. This role is crucial for translating conceptual designs into tangible early-stage prototypes, directly contributing to Bosch’s initiatives in next-generation data center infrastructure. The intern’s hands-on work will help define the practical application and integration of Bosch components within complex systems.

The TL;DR
• Role: Internship
• Type: Temporary
• Pay: $38–$55 hourly
• Team: Bosch Corporate Research, collaborating with Bosch researchers and engineers
• Mission: Translate a data center rack concept into an early-stage hardware prototype using Bosch components and systems-integration methods.
• Tech Stack: Python, MATLAB, LabVIEW, CAD, microcontrollers, PLCs, test automation

What You’ll Actually Do
• Review: Review the existing system architecture, requirements, and component recommendations from the previous project phase.
• Develop: Develop a practical build plan for assembling selected Bosch hardware components into an early-stage prototype or subsystem demonstrator.
• Support: Support integration of power electronics, DC distribution, sensors, controllers, telemetry interfaces, and supporting lab equipment.
• Assist: Assist with mechanical layout, mounting, packaging, thermal/fluidic interfaces, wiring, and test-harness development for the prototype.
• Instrument: Instrument the prototype to collect electrical, thermal, fluidic, and control data, then execute basic checkout procedures and troubleshoot integration issues.

The Must-Haves
• Background: Currently pursuing an MS or PhD in electrical engineering, mechanical engineering, mechatronics, systems engineering, controls engineering, or a related field, with a minimum GPA of 3.0.
• Experience: Hands-on lab experience building, integrating, or testing engineering hardware, along with coursework or experience in two or more of: power electronics, DC distribution, embedded systems, controls, telemetry, thermal/fluid systems, mechanical prototyping, instrumentation, or data acquisition.
• Skills: Strong troubleshooting, structured problem-solving, and technical communication skills, plus the ability to read technical documentation such as schematics, wiring diagrams, mechanical drawings, or system requirements.
• Bonus: Experience integrating multidisciplinary hardware systems, exposure to data center infrastructure, rack-level power distribution, liquid cooling, or high-power systems, and familiarity with lab safety practices for electrical, mechanical, or fluidic systems.