Technical Engineering Summer Intern (2026)

Job Description

Technical Engineering Summer Intern (2026) | HP, Inc.

The Tone:
This is a pipeline requisition for a 2026 summer internship at HP, Inc., a leading global technology company based in the US. HP designs and builds a diverse portfolio that spans printing, personal computing, software, and services, serving customers in over 170 countries. This internship is an integral part of HP’s strategy to attract exceptional talent, bringing fresh ideas and innovation. Interns are expected to apply their academic knowledge to real-world engineering challenges, contribute to significant projects, and ultimately help engineer amazing experiences for customers worldwide. The program is designed to enhance overall learning, provide impact opportunities, and foster networking.

The TL;DR
• Role: Internship
• Type: Seasonal (Summer Internship)
• Location: US-based
• Pay: $29–$35 hourly
• Team: Technology & Innovation Organization
• Mission: Transform customer experiences by delivering AI-driven solutions through integrated software and hardware.
• Tech Stack: UEFI/BIOS code, AI Models

What You’ll Actually Do
• Code Development: Develop and contribute to UEFI/BIOS code specifically for HP Workstations.
• Problem Resolution: Troubleshoot and diagnose complex technical problems within engineering projects.
• Data Preparation: Gather and meticulously prepare training data essential for the development of AI Models.
• Project Engagement: Apply theoretical classroom learnings to practical, substantive engineering projects and challenges.
• Collaborative Learning: Participate in a structured 12-week program designed to balance project work with networking and executive speakers.

The Must-Haves
• Background: Candidates must have completed their 3rd year of a university technical degree or their 1st year of a Master’s degree program. Preferred academic specializations include Bachelor’s or Master’s Degrees with a focus on Hardware Engineering, Electrical Engineering, Mechanical Engineering, Industrial Design, or other related technical fields.
• Experience: Applicants must be currently eligible to work in the US and must be able to obtain work authorization in the United States in 2026. A critical requirement is that candidates must not require work authorization sponsorship in the future, as HP will not provide any assistance or sign documentation in support of immigration sponsorship, including for Curricular Practical Training (CPT) or Optional Practical Training (OPT).
• Skills: Demonstrated capability or strong interest in areas such as UEFI/BIOS code development, troubleshooting complex engineering problems, and gathering data for artificial intelligence models.