Intern Engineer, 3D Advanced Heterogeneous Integration Development

Job Description

Intern Engineer, 3D Advanced Heterogeneous Integration Development | GlobalFoundries (GF)

The Tone:
This is an internship at GlobalFoundries (GF), located in Malta, NY. GF is a leading full-service semiconductor foundry, instrumental in creating technologies and systems that drive industry transformation. Our internship program is a vital entry-level talent pipeline, designed to provide students with valuable work experience and essential skills for a successful career in the expanding semiconductor industry. This role specifically contributes to the development of 3D Advanced Heterogeneous Integration, a critical area for future semiconductor technology.

The TL;DR
• Role: Internship
• Type: Full-time
• Location: Malta, NY
• Mission: Contribute to the development of 3D Advanced Heterogeneous Integration, focusing on areas like wafer-to-wafer hybrid bonding, die-to-wafer hybrid bonding, TSV/TOV technology, and interposer development.

What You’ll Actually Do
• Perform Design of Experiments (DOEs) using both internal semiconductor tooling and at external partner facilities.
• Analyze engineering data derived from experiments and optimization efforts.
• Model processes to predict and optimize outcomes in development.
• Assist engineers in daily integration and process development tasks.
• Support all Environmental, Health, Safety & Security requirements and programs.

The Must-Haves
• Background: Must be at least a sophomore at the time of application and actively pursuing a Bachelor’s or Master’s degree in Engineering or a related field from an accredited program. A minimum overall 3.0 GPA and good academic standing are required.
• Experience: No specific prior work experience is required for applicants, but an ability to work at least 40 hours per week during the internship is essential.
• Skills: Fluency in English (written and verbal) is required. The ability to travel up to 10% for work-related activities is also necessary.
• Bonus: Candidates pursuing a PhD in Engineering or a related field are preferred. Prior related internship or co-op experience, as well as demonstrated leadership experience in academic or professional settings, are a plus. Strong written and verbal communication, planning, organizational, and project management skills (including innovating, executing solutions, and navigating ambiguity) are highly valued. Any advanced semiconductor packaging or semiconductor integration experience is a significant advantage, and a 6-month co-op position is preferred.